Telpo Showcases Innovative Smart Terminals at InnoEx 2024

Telpo, in collaboration with Qualcomm, a global leader in chip technology, made a striking appearance at InnoEx 2024, Southeast Asia's leading forum and exhibition of innovation, held on August 22-23 in Ho Chi Minh City, Vietnam. Telpo showcased a range of cutting-edge smart terminals powered by Qualcomm's advanced chipset solutions, showcasing its advanced innovation.

At the heart of Telpo's exhibition booth was a series of smart terminals and solutions designed to revolutionize the commercial landscape by embracing digital trends and creating new business scenarios.

Telpo Terminals Empower Digital Retail Scenarios

lTelpo K8, Self-Ordering Kiosk with Palm Vein Payment

This kiosk not only streamlines the ordering process but also integrates palm vein technology for secure and contactless payments, offering a seamless dining experience.

lTelpo M Series with SoftPOS Support

Designed for high-performance and flexibility, the Telpo M1, M8 and M10 support SoftPOS, allowing merchants to accept diverse payments, enhancing efficiency and customer service.

lTelpo C50, AI Checkout Terminal

Leveraging artificial intelligence, the Telpo C50 terminal automates the checkout process, reducing wait times and providing a more interactive shopping experience.

Exhibition Highlights

lTelpo booth draws a steady stream of visitors

lMany outstanding partners gave exciting on-site speeches and provided audiences with deep insights.

InnoEx 2024 was an excellent opportunity for Telpo to demonstrate our commitment to innovation and our ability to deliver smart, efficient, and secure solutions for modern commercial scenarios. Telpo's partnership with Qualcomm has been instrumental in bringing these advanced technologies to actual application and empowering businesses to thrive in the digital era. Let’s create a colorful future together!

Tags: InnoEx 2024, Retail Technology Exhibition, Smart Terminal, Qualcomm, Telpo